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»ö¾¹©Ê¯à¡G «¬¸¹¡GJEM2100
 
1. ¸ÑªR«×¡J®æ¤l¹³ ( Lattice Image )¡J0.14nm¡B²É¤l¹³ ( Point Image )¡J0.19nm
2. ¸Õ¤ù®y¶É±×«×¡J¡Ó25¢X
3. ¥[³t¹qÀ£¡G80~200KV
4. ©ñ¤j­¿²v¡J50~1.5M
5. ¹q¤lºj¨t²Î¡GLaB6 ¿Oµ·
6. ¹q¤l§ôª½®|¡G³Ì¤p0.5nm
ªA°È¶µ¥Ø¡G
 
1. §÷®Æªí­±²Õ´¡BÂ_­±¡B·L²Ó²Õ´¡B´¹Åéµ²ºc¤Î¯Ê³´Æ[¹î¤ÀªR
2. ¥þ¯àÃЩw©Ê(­ì¤l§ÇB5~U92)¤Î¥b©w¶q¤ÀªR(§tEDS¡BMapping¡BLinescan)
3. ¹q¤l¶®g´¹¹³§P©w
4. ¼Æ¦ì¼v¹³¨t²Î¡A¥i§@¼Æ¦ì¼v¹³Â^¨ú¤Î¤ÀªR
5. §Q¥ÎÂ÷¤l´îÁ¡¾÷¡B¥W¤ù¾÷¨Ñ¨Ï¥ÎªÌÁ¡¤Æ¦UºØ¸Õ¤ù
¼Ë¥»·Ç³Æ»Ýª¾¡G(¥»¾÷¥x¤£¨ü²zºÏ©Ê¡B°ª¤À¤l¡B¦³¾÷ª«µ¥¼Ë«~)
 
1. ¯»¥½±Ä¥ÎÁáºÒ»Éºô200~300mesh,D:3mm
2. §÷®ÆÁ¡¤ÆªÌ«p«× 1000nm,D:3mm
3. ¸Õ¤ù»s§@¥Ñ¨Ï¥ÎªÌ¦Û²z
4. ¼Ë«~¶·°®Àê¡A¦b¯uªÅµL´§µo©Ê
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1. TEM¤Q¶®g¡G3,000/®É¬q ( ¾Þ§@¥H¤T¤p®É¬°¤@®É¬q­p )
2. «ù¦³°õ·Ó¡G2,000¤¸/®É¬q( ¾Þ§@¥H¤T¤p®É¬°¤@®É¬q­p )
3. EDS+Mapping+Linescan¡G1,500¤¸/®É¬q( ¾Þ§@¥H¤T¤p®É¬°¤@®É¬q­p )
4. «ù¦³°õ·Ó¡G 500¤¸/®É¬q( ¾Þ§@¥H¤T¤p®É¬°¤@®É¬q­p )
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»ö¾¹©Ê¯à¡G «¬¸¹¡GJEM2000FX¢º
 
1. ¸ÑªR«×¡J®æ¤l¹³ ( Lattice Image )¡J0.14nm¡B²É¤l¹³ ( Point Image )¡J0.28nm
2. ¸Õ¤ù®y¶É±×«×¡J¡Ó45¢X
3. ¥[³t¹qÀ£¡G80~200KV
4. ©ñ¤j­¿²v¡J50~800K
5. ¹q¤lºj¨t²Î¡GLaB6orW ¿Oµ·
6. ¹q¤l§ôª½®|¡G1£gm~2nm
ªA°È¶µ¥Ø¡G
 
1. §÷®Æªí­±²Õ´¡BÂ_­±¡B·L²Ó²Õ´¡B´¹Åéµ²ºc¤Î¯Ê³´Æ[¹î¤ÀªR
2. ¥þ¯àÃЩw©Ê(Na11~U92)¤Î¥b©w¶q¤ÀªR
3. ¹q¤l¶®g´¹¹³§P©w
4. §Q¥ÎÂ÷¤l´îÁ¡¾÷¡B¥W¤ù¾÷¨Ñ¨Ï¥ÎªÌÁ¡¤Æ¦UºØ¸Õ¤ù
¼Ë¥»·Ç³Æ»Ýª¾¡G
 
1. ¯»¥½±Ä¥ÎÁáºÒ»Éºô 200~300mesh,D:3mm
2. §÷®ÆÁ¡¤ÆªÌ«p«× 1000nm,D:3mm
3. ¸Õ¤ù»s§@¥Ñ¨Ï¥ÎªÌ¦Û²z
4. ¼Ë«~¶·°®Àê¡A¦b¯uªÅµL´§µo©Ê
¦¬¶O¼Ð·Ç¡G
 
1. TEM¤QEDS¡G800/¤p®É ( ¾Þ§@¥H¤T¤p®É¬°¤@³æ¦ì­p )
2. «ù¦³°õ·Ó¡G300¤¸/¤p®É ( ¾Þ§@¥H¤T¤p®É¬°¤@³æ¦ì­p )
3. ·Ó¤ù¡G100¤¸/±i
»ö¾¹­t³d¤H­û³sµ¸¤è¦¡¡G
 
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»ö¾¹±M®a¡G¾G²Ð¨}°Æ±Ð±Â (03) 4227151~34233
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1. ¶q´ú©TºA®ÖºÏ¦@®¶¥úÃСC
ªA°È¶µ¥Ø¡G
 
1. 1H¡A13C¡A29Si¡A 27Al¡A23Na¡A119Sn¡A11B¡A2H¡A7Li¡A51V¡A71Ga µ¥¡C
2. 2D ¥úÃСC
3. ÅܷŹêÅç¡C
¼Ë¥»·Ç³Æ»Ýª¾¡G
  »Ý¯»¥½ª¬¡A¬ù 0.3 ¦Ü 0.5 §J¡Aµø¤ñ­«¦Ó©w¡C­Y«D¯»¥½¡A»Ý§Ë¦¨¤j¤p¬Û¦P¤§²Ó¤pÁû²É ( ¦]»Ý°ª±ÛÂà¡A§¡¤Ã«×­n°÷)¡C
¦¬¶O¼Ð·Ç¡G
 
1. One pulse¡A¥b¤p®É¤º 400 ¤¸¡A¶W¹L¤Q¤ÀÄÁ¥[¦¬ 100 ¤¸
2. ¥h²B°¸·¥¹êÅç¡A¥b¤p®É¤º 400 ¤¸¡A¶W¹L¤Q¤ÀÄÁ¥[¦¬ 100 ¤¸
3. T1 and T2 measurements¡A¥b¤p®É¤º 400 ¤¸¡A¶W¹L¤Q¤ÀÄÁ¥[¦¬ 100 ¤¸
4. ¥æ¤e·¥¤Æ¹êÅç CP/MAS¡A¥b¤p®É¤º 400 ¤¸¡A¶W¹L¤Q¤ÀÄÁ¥[¦¬ 100 ¤¸
5. ÅܷŹêÅç¡A¨C¤@·Å«×¥[¦¬ 200 ¤¸
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  ¤¤¥¡¤j¾Ç¬ì¥|À] 207
 

 
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1. LV-SEM¥DÅé¡G¦b¤@¯ë¤Î§C¯uªÅ¤U ( 1-270 pa ) ¹ïªí­±¤Î¥ßÅéµ²ºc¤§Æ[¹î¤Î·Ó¬Û
2. Ááª÷ ( ºÒ ) ¾÷¡G¦b¼Ë«~ªí­±Áá¾É¹qª÷½¤ºÒ½¤
3. EDS ¨t²Î¡G¤ÀªR¼Ë«~¤§¤¸¯À ( B-U )
4. EBSD ¨t²Î¡G¨M©w¼Ë«~¤¤¤p°Ï°ì´¹Åéµ²ºc
5. §N­á¼Ë«~®y¡G§Ö³t§N­á¼Ë«~¤Î in-situ Áὤ¥Î
6. ¼Ë«~¥[¼ö®y¡Gin-situ ¼Ë«~¥[¼ö
ªA°È¶µ¥Ø¡G
 
1. SEM ( SEI,BEI )
2. EDS ¥þ¯àÃÐ
3. EDS Mapping
4. EDS Line-scan
5. EDS¤¸¯À¥b©w¶q¤ÀªR
6. Ááª÷ ( ºÒ )
7. Cryogenic Stage
8. Heating Stage
9. EBSD Analysis
10. Low Vacuum Æ[¹î
¼Ë¥»·Ç³Æ»Ýª¾¡G
 
1. ¼Ë«~­±¿n°ª¡Õ1cm¡Aª½®|¡Õ2cm
2. ¼Ë«~¦p¬°¯»¥½ª¬¡A¶·¥ý³B²z¹L ( ¼öÆ^¡BÀ£¶ô¡BÂo¯È¹LÂo ¡K µ¥ )
3. ¨Ï¥ÎªÌ²Ä¤@¦¸¹w¬ù¶·»PºÞ²z­û°Q½×¼Ë«~³B²z°ÝÃD
¦¬¶O¼Ð·Ç¡G
 
1. SEM Æ[¹î¡A¨C®É¬q ( ¤T¤p®É ) 2400¤¸
2. EDS ¥þ¯àÃСA¨C¥÷³ø§i 500 ¤¸
3. EDS Mapping¡A¨C¥÷³ø§i 1000 ¤¸
4. EDS Line-scan¡A¨C¥÷³ø§i 500 ¤¸
5. EDS ¤¸¯À¥b©w¶q¤ÀªR¡A¨C¥÷³ø§i 1000 ¤¸
6. Ááª÷ ( ºÒ )¡A¨C§å 600 ¤¸
7. Cryogenic Stage¡A¨C¦¸ 1000 ¤¸
8. Heating Stage¡A¨C 1000 ¤¸
9. EBSD Analysis¡A¨C¤@°Ï°ì¨C¦¸ 2000 ¤¸
»ö¾¹­t³d¤HÁpµ¸¤è¦¡¡G
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  ¤¤¤j¤uµ{¤­À] A ´É1F 117«Ç
 

 
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1. UltraShield magnet/shim
2. RF section
3. multlink HPPR preamplifier system
4. digital control and acquistion system
5. digital quadrature detection
6. multinuclear transmitter system
7. variable temperature unit
8. BBO BB probe with ATM
9. Dual inverse HRMAS probe
10. software-XWINNMR
ªA°È¶µ¥Ø¡G
 
1. ¤Æ¾Ç·PÀ³§÷®Æ¡C¹ï¶H¥H¦³¾÷¤À¤l¤Î°ª¤À¤l¬°¥D¡C
2. ±q¨Æ·s¦X¦¨§÷®Æªºµ²ºcŲ©w¬ã¨s¡C
3. ¤ÀªR¤Î°»´ú²Õ¦X¦¡©T¬Û¦X¦¨¤ÏÀ³¶i¦æµ{«×¡C
4. ³J¥Õ½è»P ligand ¿ù¦Xª«¤§µ²ºcŲ©w¡C
5. ¨ä¥¦¥Íª«¬ì§Þ¤è­±¤§¬ã¨s¡C
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1. ²BÃСA500¤¸/­Ó/0.5¤p®É
2. ºÒÃСA1000¤¸/­Ó/2¤p®É
3. ªø®É¶¡´ú¸Õ¡A¾ã±ß¹êÅç 300¤¸/®É
4. ÁCÃСA1000¤¸/­Ó/0.5¤p®É
5. Cosy(2D¹êÅç)¡A1800¤¸/­Ó/1¤p®É
6. HMQC(2D¹êÅç)¡A2000¤¸/­Ó/3¤p®É
»ö¾¹­t³d¤HÁpµ¸¤è¦¡¡G
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  ¤¤¥¡¤j¾Ç¬ì¾Ç¤TÀ]¤@¼Ó104«Ç
 

 
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1. Resolution : 40nm, 100nm, 200nm, 400nm
2. Minimum feature : 0.5 £gm
3. Laser sources : 244nm, 363nm, 413nm, 442nm
4. Substrates : glass, silicon or any other flat materials
5. Exposure : photoresist
6. Image size : 140mm x 140mm
7. §Q¥Î¹p®gª½¼g¥ú¸n©Î¤¸¥óµ²ºc
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  ¨Ï¥Î³W½d¡B¤½§i ( ·Ð½Ð¸Ô¾\ )¡G¦b½u¤W¹w¬ù ( ¹êÅç¥ó¼Æ½Ð¶ñ±ý»s§@¤§¥ú¸n¤ù¼Æ ) ¤§«á¡A½Ð¦Ü "¥ªÄæ->»ö¾¹ºÞ²z§@·~->»ö¾¹¹w¬ù¥Ó½Ðªí®æ" ¤U¸ü¨Ã¶ñ¼g¥Ó½Ð³æ¡A¦A¥æ¥Ñ¥Ó½ÐªÌ¤§¥DºÞ©Î«ü¾É±Ð±Âñ¦W«á¡A£¸¨Ö¦Û¦æ¤W¶Ç FTP ÀɮסAIP:140.115.72.55¡A±b¸¹/±K½X¡Gmask¡Aport:21¡A¨j§¹¦¨¥Ó½Ð¨BÆJ¡F§_«h£¸¶g¤º±N¤©¥H¨ú®ø½u¤W¤§¹w¬ù¡C
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  ¥ú¸n»s§@ 1¤ù 7100 ¤¸
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1. UHR FE-SEM¥DÅé¡G¶W°ª¯uªÅ¡B§C¯uªÅ¡BBEI¼Ë«~ªí­±¤Î¥ßÅéµ²ºc¤§Æ[¹î¡C
2. Ááª÷(ºÒ)¾÷¡G¦b¼Ë«~ªí­±Áá¾É¹qª÷½¤¡BºÒ½¤
3. EDS ¨t²Î¡G¤ÀªR¼Ë«~¤§¤¸¯À
ªA°È¶µ¥Ø¡G
 
1. SEM ( SEI,BEI )
2. EDS ¥þ¯àÃÐ
3. EDS Mapping
4. EDS Line-scan
5. EDS¤¸¯À¥b©w¶q¤ÀªR
6. Ááª÷ ( ºÒ )
7. ¶W°ª¯uªÅ¼Ë«~ªí­±¤Î¥ßÅéµ²ºc¤§Æ[¹î
8. §C¯uªÅ¼Ë«~ªí­±¤Î¥ßÅéµ²ºc¤§Æ[¹î
¼Ë¥»·Ç³Æ»Ýª¾¡G
 
1. ¼Ë«~­±¿n¨Ï¥ÎªÌ¹ï¸Õ¤ù¥²»Ý¸Ô²Ó»¡©ú¸Õ¤ù¤§§÷®ÆºØÃþ¡B»s§@¤è¦¡»P·»¾¯ºØÃþ¡A´î¤Ö»ö¾¹¤£¥²­nªº¦Ã¬V¡C
SEM¾÷¥x¹ï©ó°e´ú¼Ë«~À³¸Ó¨ã¦³¾A·í¡B¨¬°÷ªº¾÷±ñ±j«×¡A¥HÁ×§K¦b¶i¥X¹qÃè¡B©Î¦bÀË´úªº¾Þ§@¹Lµ{¤¤¡Aµo¥Í­é¸¨¡B¯Üµõªºª¬ªp¡C
2. ©Úµ´¨ü²z¤§§÷®Æ:
§Cº²ÂIªº§÷®Æ¦p: ä¡¡B¿ü¡BñSµ¥¡A·|²£¥Í¬ÛÅܤλ]Áá®ÄÀ³¡C
¦b¹q¤l§ô·Ó®g¤U·|¤À¸Ñ¡B©ÎÄÀ¥X®ðÅ餧¼Ë«~¦p¦³¾÷ª«¡B°ª¤À¤lµ¥¡CÁ×§K¼vÅT¯uªÅ¤§¸·¡C
¨ã±jºÏ©Ê©Î©ö³Q¹qºÏ³zÃè§l¤Þªº¯»¥½«¬¦¡¼Ë«~©Î§÷®Æ¡C
§t¦³¤ô¥÷¥¼¸g¥¿½T³B²z©Î¥R¤À°®Àꪺ¼Ë«~¡C
¯»¥½¼Ë«~¡A¥¼¹w¥ýÆ^®I¤£±µ¨üÀË´ú¡C(½Ð¥H¾ð¯×Æ^®I ¸û¤£«ØÄ³¥Î¹q¤ìÆ^®I)
3. ¨Ï¥ÎªÌ²Ä¤@¦¸¹w¬ù¶·»PºÞ²z­û°Q½×¼Ë«~³B²z°ÝÃD
¦¬¶O¼Ð·Ç¡G
 
1. SEM Æ[¹î¡A¨C®É¬q ( ¤T¤p®É ) 6000¤¸
2. EDS ¤¸¯À¥b©w¶q¤ÀªR¡A¨C¥÷³ø§i 1000 ¤¸
3. EDS Mapping(§t©w©Ê¡B¥b©w¶q)¡A¨C¥÷³ø§i 1500 ¤¸
4. EDS Line-scan(§t©w©Ê¡B¥b©w¶q)¡A¨C¥÷³ø§i 1500 ¤¸
5. EDS Mapping¤ÎLine-scan¤ÀªR¡A¨C¥÷³ø§i 2000 ¤¸
6. Ááª÷ ( ºÒ )¡A¨C§å 600 ¤¸
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1. Micofocus Monochromatic Al anode X-ray ( XPS, mapping ,depth profile )
2. ³õµo®g¹q¤lºj ( ¼Ú³Ç¹q¤l¯àÃÐ ) Field emission gun(AUGER facility) SAM .depth profile
3. µµ¥~½u¥ú·½ ( µµ¥~¥ú¹q¤l¯àÃÐ ) UPS facility
4. ¼Ë«~·Ç³Æ«Ç°t³Æ¥[¼ö§N«o¸Ë¸m¤Î°ªÀ£¤ÏÀ³¼Ñ ( preparation chamber fit with heating and cooling device and high pressure gas cell )
ªA°È¶µ¥Ø¡G
 
  ESCA :
1. ¼Ë«~ªí­±¥þ¯àÃб½´y
2. ¼Ë«~ªí­±³æ¤¸¯À®ñ¤ÆºA¤À¥¬¯àÃб½´y
3. Â÷¤l»kÀ»¤U¡A¦U¤¸¯À¤£¦P®ñ¤ÆºA¼Ë«~ªí¼h¤§Áa²`¤À§G
4. ¤¸¯À¦b¼Ë«~ªí­±¤§¤Gºû¤À¥¬¼v¹³¤ÀªR
  AES :
1. ¼Ë«~ªí­±¤¸¯À¤§¤ÀªR
2. Â÷¤l»kÀ»¤U¦U¤¸¯À¤§Áa²`¤À§G
3. ¤¸¯À¦b¼Ë«~ªí­±¤§¤Gºû¤À¥¬¼v¹³¤ÀªR
  UPS :
1. µµ¥~¥ú¹q¤l¯àÃдú©w
¼Ë¥»·Ç³Æ»Ýª¾¡G
 
1. ¼Ë«~¤£±o¨ã¦³ºÏ©Ê¡B¬r©Ê©Î¿ç®g©Ê
2. ¼Ë«~¶·¦Û¦æ«e³B²z°®²b¡A¤£±o¦b¯uªÅ¤U¦³´§µo©Êª«½è©ñ¥X
3. ¼Ë«~­Y¶·»ö¾¹ªþ¥ó«e¸m³B²z½Ð¥ý§iª¾
4. ¯»Åé¼Ë«~»Ý¥ý¥´¤ù
5. ¼Ë«~°ª«×¤£±o¶W¹L 1cm, ­±¿n¤£¶W¹L 0.5cm*0.5cm
6. ¼Ë«~¤ÀªR§¹²¦¤£ÂkÁÙµ¹°eÀ˳æ¦ì
¦¬¶O¼Ð·Ç¡G
 
1. ESCA ªí­±¤¸¯À¤ÀªR¡G2500¤¸/¤p®É
2. ESCA ³æ¤¸¯À¯àÃФÀªR¡G2500¤¸/¤p®É
3. ESCA Áa²`¤À¥¬¤ÀªR¡G2500¤¸/¤p®É
4. Auger ªí­±¦¨¥÷¤ÀªR¡G2500¤¸/¤p®É
5. Auger Áa²`¤À¥¬¤ÀªR¡G2500¤¸/¤p®É
6. Auger ¤¸¯À¼v¹³±½´y¤ÀªR¡G2500¤¸/¤p®É
7. µµ¥~¥ú¹q¤l¯àÃФÀªR¡G2500¤¸/¤p®É
»ö¾¹­t³d¤HÁpµ¸¤è¦¡¡G
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1. ³Ì¤j¸ÑªR«×¥i¹F 20,000¡C
2. ³Ì¤j°»´ú½è¶q¥i¹F 2000 Daltons¡C
3. ¨t²Î¨ã¥¿Â÷¤l¤Î­tÂ÷¤l°»´ú¯à¤O¡A¨Ã¥i¿ï¾Ü§@¥þ±½´y ( Full scan ) ©Î¥[³t¹qÀ£¼Ò¦¡¤§¿ï¾ÜÂ÷¤lºÊ´ú ( SIR )¡C
ªA°È¶µ¥Ø¡G
 
1. ½ÆÂøª«½èªº¦¨¤À©w©Ê»P©w¶q´ú©w¡A¦pÃĪ«ªº·s³¯¥NÁª«¡B´Óª«¤¤¤§¥Íª«ÆP¡B°ª¤À¤l¤¤²K¥[ª«§t¶q¡BÀô¹Ò¦Ã¬Vª«¤§´ú©wµ¥¡C
2. ´£¨Ñ¦h¤è¦¡¶i¼Ë¥\¯à ( ¦p GC¡BFAB¡BDIP µ¥ ) »PÂ÷¤l¤Æ¤è¦¡ ( ¦p EI¡BCI )¡C
¦¬¶O¼Ð·Ç¡G
 
1. DIP-EI¡G700¤¸/¤p®É
2. DIP-HREI¡G1500¤¸/¤p®É
3. DIP-CI¡G700¤¸/¤p®É
4. FAB¡G1200¤¸/¤p®É
5. HRFAB¡G2000¤¸/¤p®É
6. GC-HRMS¡G°ò¥»¦¬¶O 1500 ¤¸¡A¨C¼W¥[¥b¤p®É¥[¦¬ 500 ¤¸
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